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NEW QUESTION # 108
Where can the NVRAM on a FlashArray//E be located?
Answer: D
Explanation:
Understanding the hardware architecture of the Pure Storage FlashArray//E is crucial for proper deployment and capacity management. The FlashArray//E (and FlashBlade//E) family was specifically engineered to deliver an all-flash solution for capacity-optimized, tier-2 workloads and unstructured data repositories, aiming to replace legacy spinning disk (HDD) environments entirely.
To achieve this massive storage density at a disruptive price point, the //E series exclusively utilizes Quad- Level Cell (QLC) flash. While older arrays (like the //X50) use strictly dedicated NVRAM modules centrally located in the chassis, and higher-end TLC arrays (like the //XL) use DirectFlash Modules with Distributed NVRAM (DFMDs), the FlashArray//E utilizes a highly specialized drive.
On the FlashArray//E, the non-volatile write cache is distributed across DFMes . "DFMe" is the specific Pure Storage hardware nomenclature for a QLC-based DirectFlash Module that includes integrated, distributed NVRAM. By moving the NVRAM directly onto the QLC capacity modules, the //E architecture eliminates the need for dedicated NVRAM bays, streamlines the write path, and allows the write cache bandwidth to scale linearly as the customer adds more capacity to the system.
NEW QUESTION # 109
Which NVRAM bays are always populated on the FlashArray//XR2/3?
Answer: C
Explanation:
The FlashArray//XR2 and //XR3 architectures utilize dedicated NVRAM modules to provide the non-volatile write cache necessary for acknowledging writes safely before they are destaged to flash. These chassis are equipped with multiple NVRAM bays (labeled NVB0 through NVB3).
For standard configurations, specifically the //X10, //X20, and //X50 models, the system requires a redundant pair of NVRAM modules to function. These are always installed in NVRAM bays 0 and 1.
Bays 0 and 1 form the primary high-availability pair. If one fails, the other retains the data, and the system can continue to operate (though often in write-through mode or with alerts).
Higher-end models like the //X70 and //X90 populate all four bays (0-3) to provide the larger write buffer required for their higher throughput capabilities.
However, since the question asks which bays are always populated (i.e., the minimum requirement for the platform to function across the board), the answer is the foundational pair in slots 0 and 1. An Implementation Engineer must ensure these specific slots are populated first during any chassis maintenance or upgrade.
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NEW QUESTION # 110
The Pure Engagement Request (PER) specifies that iSCSI ports ETH2 and ETH3 should be set to 10 Gb/s. After configuring the ports and connecting them to the SAN, the Implementation Engineer observes that ETH2/3 are not negotiating and display 0 b/s. The SAN is operating at 40 Gb/s, with support for up to 100 Gb/s. What should the Implementation Engineer do to resolve this issue and complete the install?
Answer: A
Explanation:
This scenario describes a physical layer mismatch between the FlashArray optics and the customer's switch infrastructure.
The PER (planning document) specified 10 Gb/s, so the Implementation Engineer likely installed 10 Gb SFP+ transceivers into the array.
The SAN Switch is operating at 40 Gb/s (likely using QSFP+ ports).
You cannot simply "force negotiate" a 10Gb SFP+ optic to run at 40Gb/s, nor can you plug a 10Gb SFP+ directly into a 40Gb QSFP+ port without specific breakout cables or QSA adapters that match the signaling. The physical transceivers themselves are incompatible with the link speed required by the switch.
To resolve this, the Implementation Engineer must replace the transceivers with the appropriate type.
If the switch is 40Gb native, the array needs 40Gb (QSFP+) optics (if supported on that slot).
Alternatively, if the customer intends to use 10Gb, they must provide 10Gb ports on their switch side.
Given the prompt implies the SAN is 40Gb, the 10Gb optics in the array are the incorrect hardware for that link.
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NEW QUESTION # 111
An Implementation Engineer is installing a second DirectFlash Shelf (DFS) on a FlashArray//XR4 controller.
How should the Implementation Engineer complete the installation?
Answer: C
Explanation:
The FlashArray//XR4 introduces a new chassis layout and PCIe slot numbering scheme compared to previous generations. For expansion connectivity, specific slots are designated for the backend SAS or Ethernet/RoCE fabric cards that connect to DirectFlash Shelves.
According to the //XR4 hardware guide and expansion best practices, PCIe slot 3 is the designated location for the additional expansion interface card required when adding a second DirectFlash Shelf (or for specific shelf configurations). Slots 0 and 1 are often reserved for host I/O or other functions, and slot numbering
/priority is strict to ensure the BIOS and Purity software correctly recognize the card function.
Installing the card in the wrong slot (like slot 0 or 4, if those are reserved for other uses or primary I/O) could result in the shelf not being detected, the array failing to boot, or suboptimal performance due to PCIe lane allocation. Therefore, the engineer must install the DFS expansion card into PCIe slot 3 and cable the second shelf to the ports on that specific card to ensure a supported and functional configuration.
NEW QUESTION # 112
An Implementation Engineer is onsite to install a new DFM data pack (DP) to CH0.BAY10-CH0.BAY19 of a FlashArray.
After adding the drives to the chassis, which command should the Implementation Engineer run to verify if the new DP is in a wide write group?
Answer: C
Explanation:
The puredrive list --pack command shows detailed information about the specified data pack, including whether its drives are part of a wide write group.
NEW QUESTION # 113
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